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The course discusses vacuum and gas handling systems in the context of semiconductor fabrication. Learners begin by exploring the nature of gases and the properties of substances in the gas state. The focus then shifts to the concept of pressure and the introduction of the concept of vacuum. Learners examine the components of a vacuum system and the need for various design choices, pump types, and classes of pressure gauges. Learners recognize that operating vacuum systems require safely pumping down the vacuum chamber, cycling and purging process compartments, and understanding venting and exhaust principles.

The course also addresses the hazards associated with vacuum systems, including risks of unintended overpressure, hazardous gas release, material failures, and challenges related to process equipment in vacuum environments. Safe handling of compressed gases requires an understanding of the related hazards. Learners examine issues such as high pressure, asphyxiation risks, toxic gases, flammable and pyrophoric gases, as well as oxidizing and corrosive substances. The risks of cryogenic liquids stored under their own vapor pressure are also discussed. Additionally, learners review standards for hazard communication and labeling practices.

Technician working with precision equipment in a cleanroom manufacturing environment

To earn the OASiS Foundations program micro-credential, learners must complete the following steps:

  1. Complete the following courses with associated quizzes
  • OASiS 01: Introduction to the Semiconductor Processing Environment - Cleanroom and Safety Protocols
  • OASiS 02: Chemical Safety in Semiconductor Processing
  • OASiS 03: Introduction to Integrated Circuits (IC) Fabrication Processes and Metrology
  • OASiS 04: Introduction to Semiconductor Manufacturing and Equipment Safety
  • OASiS 05: Professional Skills
  1. Final Requirement: The OASiS Foundations Program micro-credential requires all learners to complete ONE of the following three cleanroom experience options. Learners may register for a cleanroom experience any time after completing the OASiS 01 course.
  • Option 1: OASiS 0A: Cleanroom Facility Experience
  • Option 2: OASiS 0B: AV/VR Cleanroom Simulation
  • Option 3: OASiS 06: Vacuum and Gas Handling 

Note: This course duplicates content from Cleanroom Experience Option 3: OASiS 06 in the OASiS Foundations program. Learners who have already completed Option 3 do not need to take this course.

Course Outline

This course focuses on the following modules:

  • Part 1: Overview and Theory on Gas Pressure and Vacuum
  • Part 2: Vacuum System
  • Part 3: Vacuum Safety
  • Part 4: Gas Handling
  • Part 5: Compressed Gas Safety

Learner Outcomes

By the end of this course, participants will be able to:

  • Define the concept of compressed gases and vacuum.
  • Explain the role of vacuum in semiconductor manufacturing.
  • Identify hazards associated with vacuum systems.
  • Detail the role of compressed gases in semiconductor manufacturing.
  • Describe how to work safely with compressed gases.

Who Should Register?

This course is ideal for individuals interested in semiconductor manufacturing, materials, devices, and circuits.  A foundational knowledge of physics and chemistry at a high school level is helpful but not required. No prior knowledge on CMOS or other semiconductor technology is required.

What You'll Earn

After completing all program requirements, learners earn the OASiS Foundations micro-credential.

University of Cincinnati micro-credential for OASiS Foundations.

View the OASiS Foundations Badge

Learn more about UC Skills credentials on our credentials page

 

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Select a section to register

Section Title
Vacuum and Gas Handling
Type
Online Self-Paced (Non-Facilitated)
Duration
Aug 25, 2025 to Jun 30, 2026
Cost
Required Software
This course uses Canvas, the University of Cincinnati's learning management system, which requires DUO two-factor authentication. *Canvas Access: If you already have UC credentials, you can access your course on Canvas once the instructor publishes it. *New to UC? You will receive an email with your UC credentials within 7 business days of registration. Please check your registration receipt for additional information. *Two-Factor Authentication (DUO): UC requires DUO two-factor authentication to access the UC network, Canvas, and other tools on personal devices. More detailed instructions for setting up DUO and using Canvas will be available in your learner portal after registration.

Section Notes

Learn more about the OASiS Foundations program.

The College of Engineering and Applied Sciences (CEAS)

The College of Engineering and Applied Science is organized into eight departments. Each offers multiple degrees, both graduate and undergraduate, and provides students with rich experience in the classroom, in the lab and on the job. 

  • Aerospace Engineering & Engineering Mechanics
  • Biomedical Engineering
  • Chemical and Environmental Engineering
  • Civil and Architectural Engineering and Construction Management
  • Computer Science
  • Electrical and Computer Engineering
  • Engineering and Computing Education

With real-world experiences at firms and research centers across the country and around the world, our students graduate with skills and confidence to turn ideas into reality, solving tomorrow’s problems today and seeking out new challenges.

OASiS

The Ohio-Southwest Alliance on Semiconductors and Integrated Scalable Manufacturing (OASiS) team was established in 2022 with the support of Intel. The goal of OASiS is to provide individuals with strong STEM backgrounds with the very fundamental skills required to pursue semiconductor careers. Altogether, OASiS has engaged 15 universities, colleges, community colleges, and regional campuses in southwest Ohio. 


To date, over 1000 students with backgrounds in electrical and computer engineering, computer science, chemical engineering, mechanical and material engineering, physics, and chemistry have successfully gone through the program. The ultimate goal of the OASiS team is to be able to provide semiconductor workforce development opportunities by delivering modules to students interested in the area of semiconductor manufacturing, materials, devices and circuits so they can be part of the needed 100,000+ workforce needed in the field by 2030.   

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