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This course, Introduction to Integrated Circuits Fabrication Processes and Metrology, is part of the OASiS Foundations Program. 

These days microprocessors and integrated circuits (ICs) can have billions of tiny transistors that serve as unit cells for computing or data storage. This course will introduce learners to the basics of the semiconductor manufacturing process, tools, and how different processes are sequenced together to create useful electronic functions.

To earn the OASiS Foundations program micro-credential, learners must complete the following steps:

  1. Complete the following courses with associated quizzes
  • OASiS 01: Introduction to the Semiconductor Processing Environment - Cleanroom and Safety Protocols
  • OASiS 02: Chemical Safety in Semiconductor Processing
  • OASiS 03: Introduction to Integrated Circuits (IC) Fabrication Processes and Metrology
  • OASiS 04: Introduction to Semiconductor Manufacturing and Equipment Safety
  • OASiS 05: Professional Skills
  1. Final Requirement: The OASiS Foundations Program micro-credential requires all learners to complete ONE of the following three cleanroom experience options. Learners may register for a cleanroom experience anytime after completing the OASiS 01 course.
  • Option 1: OASiS 0A: Cleanroom Facility Experience
  • Option 2: OASiS 0B: AV/VR Cleanroom Simulation
  • Option 3: OASiS 06: Vacuum and Gas Handling 

OASiS logo with stylized circuit design on a blue background

Course Outline

This course focuses on the following modules:

  • Part 1: Overview of the CMOS Process Flow
  • Part 2: Gate Dielectrics
  • Part 3: Mask Design, Patterning and Lithography
  • Part 4: Plasma Etching
  • Part 5: Doping
  • Part 6: Thin Film Metallization
  • Part 7: Metrology and Packaging

Learner Outcomes

By the end of this course, learners will be able to:

  • Explain critical manufacturing steps involved in IC fabrication.
  • Identify tools used in IC manufacturing processes.
  • Explain the relationship between circuit design, mask design, and process design.
  • Define ion implant, chemical mechanical polish, and inline process control.
  • Define gate dielectric.

Who Should Register?

This course is ideal for learners interested in semiconductor manufacturing, materials, devices, and circuits. A foundational knowledge of physics and chemistry at a high school level is helpful but not required. No prior knowledge on CMOS or other semiconductor technology is required.

What You'll Earn

After completing all program requirements, learners earn the OASiS Foundations micro-credential.

University of Cincinnati micro-credential for OASiS Foundations.

View the OASiS Foundations Badge

Learn more about UC Skills credentials on our credentials page. 

Applies to the Following Program

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Select a section to register

Section Title
Introduction to Integrated Circuits
Type
Online Self-Paced (Non-Facilitated)
Duration
Sep 01, 2026 to Jul 31, 2027
Delivery Format
Online Self-Paced (Non-Facilitated)  
Cost
Course Fee $0.00 Click here to get more information
Required Software
This course uses Canvas, the University of Cincinnati's learning management system, which requires DUO two-factor authentication. *Canvas Access: If you already have UC credentials, you can access your course on Canvas once the instructor publishes it. *New to UC? You will receive an email with your UC credentials within 7 business days of registration. Please check your registration receipt for additional information. *Two-Factor Authentication (DUO): UC requires DUO two-factor authentication to access the UC network, Canvas, and other tools on personal devices. More detailed instructions for setting up DUO and using Canvas will be available in your learner portal after registration.

Section Notes

Learn more about the OASiS Foundations program.

OASiS

The Ohio-Southwest Alliance on Semiconductors and Integrated Scalable Manufacturing (OASiS) team was established in 2022 with the support of Intel. The goal of OASiS is to provide individuals with strong STEM backgrounds with the very fundamental skills required to pursue semiconductor careers. Altogether, OASiS has engaged 15 universities, colleges, community colleges, and regional campuses in southwest Ohio. 


To date, over 1000 students with backgrounds in electrical and computer engineering, computer science, chemical engineering, mechanical and material engineering, physics, and chemistry have successfully gone through the program. The ultimate goal of the OASiS team is to be able to provide semiconductor workforce development opportunities by delivering modules to students interested in the area of semiconductor manufacturing, materials, devices and circuits so they can be part of the needed 100,000+ workforce needed in the field by 2030.   

The College of Engineering and Applied Sciences (CEAS)

The College of Engineering and Applied Science is organized into eight departments. Each offers multiple degrees, both graduate and undergraduate, and provides students with rich experience in the classroom, in the lab and on the job. 

  • Aerospace Engineering & Engineering Mechanics
  • Biomedical Engineering
  • Chemical and Environmental Engineering
  • Civil and Architectural Engineering and Construction Management
  • Computer Science
  • Electrical and Computer Engineering
  • Engineering and Computing Education

With real-world experiences at firms and research centers across the country and around the world, our students graduate with skills and confidence to turn ideas into reality, solving tomorrow’s problems today and seeking out new challenges.

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