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This Lean Manufacturing course provides participants with a foundational understanding of Lean methodology and its application in process improvement projects. This course equips individuals with the knowledge and skills necessary to contribute effectively to Lean initiatives within organizations. Upon completion of this course, participants will have a foundational understanding to support Lean projects as team members.

Cleanroom technicians in protective gear discussing semiconductor processing procedures in a lab environment

Learner Outcomes

Learners who successfully complete this course can expect the following outcomes:

  • ​Identify the basic principles and concepts of Lean methodology.  
  • Explain the types of waste and how to eliminate them.  
  • Explain the fundamental skills in using basic Lean techniques.  
  • Explain how manufacturing and service organizations can embrace Lean thinking.​

Who Should Register?

​This course is ideal for learners interested in semiconductor manufacturing, materials, devices, and circuits. No prior knowledge on semiconductor technology is required.​
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Select a section to register

Section Title
OASiS 20: Introduction to Lean Manufacturing
Type
Online Self-Paced (Non-Facilitated)
Duration
Sep 01, 2026 to Jul 31, 2027
Delivery Format
Online Self-Paced (Non-Facilitated)  
Cost
Course Fee $0.00 Click here to get more information
Instructors
  • Marc Cahay
Required Software
This course uses Canvas, the University of Cincinnati's learning management system, which requires DUO two-factor authentication. *Canvas Access: If you already have UC credentials, you can access your course on Canvas once the instructor publishes it. *New to UC? You will receive an email with your UC credentials within 7 business days of registration. Please check your registration receipt for additional information. *Two-Factor Authentication (DUO): UC requires DUO two-factor authentication to access the UC network, Canvas, and other tools on personal devices. More detailed instructions for setting up DUO and using Canvas will be available in your learner portal after registration.

Section Notes

Learn more about the OASiS Foundations program.

OASiS

The Ohio-Southwest Alliance on Semiconductors and Integrated Scalable Manufacturing (OASiS) team was established in 2022 with the support of Intel. The goal of OASiS is to provide individuals with strong STEM backgrounds with the very fundamental skills required to pursue semiconductor careers. Altogether, OASiS has engaged 15 universities, colleges, community colleges, and regional campuses in southwest Ohio. 


To date, over 1000 students with backgrounds in electrical and computer engineering, computer science, chemical engineering, mechanical and material engineering, physics, and chemistry have successfully gone through the program. The ultimate goal of the OASiS team is to be able to provide semiconductor workforce development opportunities by delivering modules to students interested in the area of semiconductor manufacturing, materials, devices and circuits so they can be part of the needed 100,000+ workforce needed in the field by 2030.   

The College of Engineering and Applied Sciences (CEAS)

The College of Engineering and Applied Science is organized into eight departments. Each offers multiple degrees, both graduate and undergraduate, and provides students with rich experience in the classroom, in the lab and on the job. 

  • Aerospace Engineering & Engineering Mechanics
  • Biomedical Engineering
  • Chemical and Environmental Engineering
  • Civil and Architectural Engineering and Construction Management
  • Computer Science
  • Electrical and Computer Engineering
  • Engineering and Computing Education

With real-world experiences at firms and research centers across the country and around the world, our students graduate with skills and confidence to turn ideas into reality, solving tomorrow’s problems today and seeking out new challenges.

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