CE-20PA1021X - OASiS 21: Introduction to Six Sigma in Semiconductor Manufacturing
This Six Sigma course provides participants with a foundational understanding of Six Sigma methodology and its application in process improvement projects within semiconductor manufacturing. This course equips individuals with the knowledge and skills necessary to contribute effectively to Six Sigma initiatives within the organizations. Upon completion of this course, participants will have a foundational understanding to support Six Sigma projects as team members and begin their journey toward obtaining Six Sigma certification.
Learner Outcomes
Learners who successfully complete this course can expect the following outcomes:
- Explain the basic principles and concepts of Six Sigma methodology.
- Describe the DMAIC (Define, Measure, Analyze, Improve, Control) framework and its application in process improvement.
- Explain the fundamental skills in using basic Six Sigma tools and techniques.
- Define roles and responsibilities within Six Sigma teams.
Who Should Register?
This course is ideal for learners interested in semiconductor manufacturing, materials, devices, and circuits. No prior knowledge on semiconductor technology is required.Select a section to register
The College of Engineering and Applied Sciences (CEAS)
The College of Engineering and Applied Science is organized into eight departments. Each offers multiple degrees, both graduate and undergraduate, and provides students with rich experience in the classroom, in the lab and on the job.
- Aerospace Engineering & Engineering Mechanics
- Biomedical Engineering
- Chemical and Environmental Engineering
- Civil and Architectural Engineering and Construction Management
- Computer Science
- Electrical and Computer Engineering
- Engineering and Computing Education
With real-world experiences at firms and research centers across the country and around the world, our students graduate with skills and confidence to turn ideas into reality, solving tomorrow’s problems today and seeking out new challenges.
OASiS
The Ohio-Southwest Alliance on Semiconductors and Integrated Scalable Manufacturing (OASiS) team was established in 2022 with the support of Intel. The goal of OASiS is to provide individuals with strong STEM backgrounds with the very fundamental skills required to pursue semiconductor careers. Altogether, OASiS has engaged 15 universities, colleges, community colleges, and regional campuses in southwest Ohio.
To date, over 1000 students with backgrounds in electrical and computer engineering, computer science, chemical engineering, mechanical and material engineering, physics, and chemistry have successfully gone through the program. The ultimate goal of the OASiS team is to be able to provide semiconductor workforce development opportunities by delivering modules to students interested in the area of semiconductor manufacturing, materials, devices and circuits so they can be part of the needed 100,000+ workforce needed in the field by 2030.